| MRC | Criteria | Characteristic |
|---|
| ADAQ | BODY LENGTH | 28.0 MILLIMETERS NOMINAL" |
| ADAT | BODY WIDTH | 28.0 MILLIMETERS NOMINAL" |
| ADAU | BODY HEIGHT | 3.7 MILLIMETERS NOMINAL" |
| AFGA | OPERATING TEMP RANGE | -40.0/+100.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | LOW POWER AND PROGRAMMABLE AND HIGH PERFORMANCE AND LOW VOLTAGE" |
| CQSJ | INCLOSURE MATERIAL | PLASTIC" |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK" |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 GATE, ARRAY" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM TOTAL SUPPLY AND 7.0 VOLTS MAXIMUM TOTAL SUPPLY" |
| FEAT | SPECIAL FEATURES | GLOBAL BUFFER SWITCHING SPEED 12.5 NANOSECONDS MAX" |
| TTQY | TERMINAL TYPE AND QUANTITY | 208 PIN" |
| ADAQ | BODY LENGTH | 28.0 MILLIMETERS NOMINAL" |
| ADAT | BODY WIDTH | 28.0 MILLIMETERS NOMINAL" |
| ADAU | BODY HEIGHT | 3.7 MILLIMETERS NOMINAL" |
| AFGA | OPERATING TEMP RANGE | -40.0/+100.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | LOW POWER AND PROGRAMMABLE AND HIGH PERFORMANCE AND LOW VOLTAGE" |
| CQSJ | INCLOSURE MATERIAL | PLASTIC" |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK" |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 GATE, ARRAY" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM TOTAL SUPPLY AND 7.0 VOLTS MAXIMUM TOTAL SUPPLY" |
| FEAT | SPECIAL FEATURES | GLOBAL BUFFER SWITCHING SPEED 12.5 NANOSECONDS MAX" |
| TTQY | TERMINAL TYPE AND QUANTITY | 208 PIN" |
