Thank you for considering Computer Microtechnology Inc part number CM1101MDE, an item we carry that is listed with the NSN 5962-00-361-8582 and product description “Microcircuit Memory.” This component is available for purchase through our website at this time, so complete the Request for Quote (RFQ) form provided below if you would like to receive pricing information for your comparisons. Simply offer our staff details like your desired quantity, budget, and delivery timeline to help us craft the best solution for your needs.
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We aim to make the process of locating and procuring exact items simple, which is why we feature key listing details with every offering. For example, part number CM1101MDE was specifically produced by Computer Microtechnology Inc under CAGE Code 12735, and with the NSN 5962-00-361-8582, it belongs to FSC 5962 Microcircuits Electronic. Additionally, all stock comes delivered with any applicable qualifying certifications or manufacturer trace documentation for your further benefit. With all of this in mind, be sure to submit a request for part number CM1101MDE today, knowing we will be in touch shortly after reviewing your information.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-00-361-8582 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 003618582 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 93529 | 3 | 2 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.800 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.265 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.160 INCHES NOMINAL |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 600.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND W/BUFFERED OUTPUT AND W/DECODED OUTPUT AND TRUE/COMPLEMENTARY AND HIGH SPEED AND LOW POWER |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 11 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 0.3 VOLTS MAXIMUM POWER SOURCE AND-15.0 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | RAM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
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