Thank you for considering National Semiconductor Corporation part number DM74S387N PROGRAMMED, an item we carry that is listed with the NSN 5962-01-165-3112 and product description “Microcircuit Memory.” This component is available for purchase through our website at this time, so complete the Request for Quote (RFQ) form provided below if you would like to receive pricing information for your comparisons. Simply offer our staff details like your desired quantity, budget, and delivery timeline to help us craft the best solution for your needs.
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We aim to make the process of locating and procuring exact items simple, which is why we feature key listing details with every offering. For example, part number DM74S387N PROGRAMMED was specifically produced by National Semiconductor Corporation under CAGE Code 27014, and with the NSN 5962-01-165-3112, it belongs to FSC 5962 Microcircuits Electronic. Additionally, all stock comes delivered with any applicable qualifying certifications or manufacturer trace documentation for your further benefit. With all of this in mind, be sure to submit a request for part number DM74S387N PROGRAMMED today, knowing we will be in touch shortly after reviewing your information.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-165-3112 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 011653112 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
1816-0438 | 2 | 1 | C | 9 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.890 INCHES NOMINAL |
ADAT | BODY WIDTH | 0.220 INCHES NOMINAL |
ADAU | BODY HEIGHT | 0.125 INCHES NOMINAL |
AEHX | MAXIMUM POWER DISSIPATION RATING | 375.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | 0.0/70.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
AGAV | END ITEM IDENTIFICATION | TEST SET 9900A |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND 3-STATE OUTPUT AND LOW POWER AND PROGRAMMABLE |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
CZZZ | MEMORY CAPACITY | UNKNOWN |
TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
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